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Soldering, Desoldering, Rework Products
Solder
Composition：
Sn63Pb37 (63/37)
(1)
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
(2)
Flux Type：
No-Clean
(2)
Water Soluble
(1)
Melting Point：
361°F (183°C)
(1)
423 ~ 424°F (217 ~ 218°C)
(2)
Mesh Type：
-
(1)
3
(1)
4
(1)
Process：
Lead Free
(2)
Leaded
(1)
Product Status：
Active
(2)
Obsolete
(1)
Shelf Life：
12 Months
(1)
6 Months
(2)
Filter：
Solder
Form : Syringe, 3.53 oz (100g)
3 Records
Image
Part
Manufacturer
Description
MOQ
Stock
Action
70-4825-0904
Kester
NP560 SN96.5AG3.0CU0.5 T4 100 GM
1
PDF
14
In-stock
Get Quote
70-1608-0804
Kester
SOLDER PASTE NO CLEAN 100GM
25
PDF
6,500
In-stock
Get Quote
57-3901-5607
Kester
SOLDERPASTE WATER SOL SYR 100GM
1
PDF
6,500
In-stock
Get Quote
70-4825-0904
Kester
NP560 SN96.5AG3.0CU0.5 T4 100 GM
Stock : 14
RFQ
70-1608-0804
Kester
SOLDER PASTE NO CLEAN 100GM
Stock : 6,500
RFQ
57-3901-5607
Kester
SOLDERPASTE WATER SOL SYR 100GM
Stock : 6,500
RFQ
1 / 1 Page, 3 Records
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